Laser Glass Drilling Machines Manufacturer

HANTENCNC’s laser glass drilling machines use advanced MOPA laser technology to achieve smooth, crack-free drilling effects. They provide precise cutting with minimal edge chipping, typically between 0.25 and 0.4 microns, making them ideal for delicate glass drilling applications.

HANTENCNC’s series of laser glass drilling machines feature high precision, high efficiency, and versatility. They are suitable for processing a variety of glass materials, such as ordinary green glass, high borosilicate glass, ultra-clear embossed glass, and transparent conductive oxide coated (TCO) glass.

HANTENCNC’s laser glass drilling machines ensure smooth and clean edges while maintaining the integrity of the glass, greatly reducing subsequent processing steps. Whether you need mass production or customized processing, this equipment is the ideal choice.

USD $10,300 - USD $13,550

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Laser Glass Drilling Machines Manufacturer

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Cutting Method		Principle	Advantages	Disadvantages
Traditional Glass Cutting	Mechanical Cutting	Uses diamond or carbide wheels for scribing, then breaks the glass along the scribed lines	Simple process, low cost	Easy to cause edge chipping and dust pollution; scribed edge requires polishing; not suitable for high-quality cutting requirements
Laser Glass Cutting	Scribing and Breaking (YAG + CO₂)	Uses low-power lasers to create thermal stresses on the glass surface, then separates along the scribed lines using mechanical or laser-assisted breaking	Non-contact, clean, and eco-friendly process	Limited applications due to thermal effects; still requires post-processing in many cases
	Thermal Laser Separation (High-power CO₂)	Uses high-power lasers to soften glass at specific locations, followed by a cooling process that causes thermal stress and results in separation	Reduces thermal impact force	More prone to glass explosion, requires precise control of thermal effect to avoid cracking
	Ultrafast Laser Cutting	Utilizes high-repetition-rate lasers that induce microcracks inside the glass, facilitating separation without significant chipping or micro-fractures	Less chipping, high-quality cuts	Expensive equipment, higher costs, complex processing requirements
	Green Laser Cutting	The laser is focused below the surface of the glass, with the focal point moving from bottom to top. Laser pulses act on the material point by point, and the laser focal point rapidly scans and moves along a predetermined path in space to achieve material removal.	Strong applicability	Lower power, lower efficiency, light pollution. It produces larger chipping than MOPA laser cutting, with chipping around 80-200 µm.
	MOPA Laser Cutting	Similar to green laser cutting, a standard MOPA laser cannot cut; the peak power must be increased.	Equipment is simple, low cost, and efficient, requires no-maintainance	Edge chipping 0.25-0.4 µm, larger than ultrafast laser cutting.