100W 120W Fiber Laser Glass Drilling Machines | Laser Drilling Machine for Glass

HANTENCNC’s laser glass drilling machine uses MOPA laser to cut glass. First, the laser glass drilling machine focuses the laser pulse on the bottom of the glass to create a micro-explosion and pulverize the glass into fine particles.

After the glass is broken into fine particles, the laser focuses scans horizontally, removing glass particles layer by layer from bottom to top and finally completing the glass drilling process.

HANTENCNC’s Laser Glass Drilling Machine Advantages

• Low equipment cost, low operating cost,
• Fast speed, high precision, good stability, non-contact processing, the yield rate is much higher than traditional processing technology,
• The minimum hole diameter for glass drilling is as small as 0.3mm, and it can process various sizes and shapes of holes,
• No taper in the hole diameter, achieving highly precise and efficient digital glass drilling.

Except traditional glass cutting method, there are three laser cutting methods in glass processing: MOPA laser cutting, green laser cutting, and ultrafast laser cutting. Here are their differences:

1. MOPA Laser Cutting: This method uses an infrared fiber laser with high peak power and short pulse width, reaching up to 200 kilowatts in nanoseconds. It’s like a precision artist, creating very small chipping on the edges, around 0.25 to 0.4 microns.
2. Green Laser Cutting: green laser cutting works like engraving inside the glass. It has more chipping than MOPA, about 80 to 200 microns. There are two types: solid-state and fiber green lasers. For better edge quality, fiber green lasers are recommended. However, green lasers have a limited lifespan.
3. Ultrafast Laser Cutting: This technique uses very short pulses (in picoseconds or femtoseconds) and has been a mature technology since 2016. It produces almost no chipping (only about 2 microns), making it great for precise cutting and surface slicing of glass. However, it is not suitable for drilling holes in glass. And, this kind of equipment is very expensive.

Cutting Method		Principle	Advantages	Disadvantages
Traditional Glass Cutting	Mechanical Cutting	Uses diamond or carbide wheels for scribing, then breaks the glass along the scribed lines	Simple process, low cost	Easy to cause edge chipping and dust pollution; scribed edge requires polishing; not suitable for high-quality cutting requirements
Laser Glass Cutting	Scribing and Breaking (YAG + CO₂)	Uses low-power lasers to create thermal stresses on the glass surface, then separates along the scribed lines using mechanical or laser-assisted breaking	Non-contact, clean, and eco-friendly process	Limited applications due to thermal effects; still requires post-processing in many cases
	Thermal Laser Separation (High-power CO₂)	Uses high-power lasers to soften glass at specific locations, followed by a cooling process that causes thermal stress and results in separation	Reduces thermal impact force	More prone to glass explosion, requires precise control of thermal effect to avoid cracking
	Ultrafast Laser Cutting	Utilizes high-repetition-rate lasers that induce microcracks inside the glass, facilitating separation without significant chipping or micro-fractures	Less chipping, high-quality cuts	Expensive equipment, higher costs, complex processing requirements
	Green Laser Cutting	The laser is focused below the surface of the glass, with the focal point moving from bottom to top. Laser pulses act on the material point by point, and the laser focal point rapidly scans and moves along a predetermined path in space to achieve material removal.	Strong applicability	Lower power, lower efficiency, light pollution. It produces larger chipping than MOPA laser cutting, with chipping around 80-200 µm.
	MOPA Laser Cutting	Similar to green laser cutting, a standard MOPA laser cannot cut; the peak power must be increased.	Equipment is simple, low cost, and efficient, requires no-maintainance	Edge chipping 0.25-0.4 µm, larger than ultrafast laser cutting.

Compared with traditional glass cutting, MOPA laser cutting is the precision choice, offering minimal chipping.

Green laser cutting, while not as precise, making larger chipping than MOPA laser cutting.

Ultrafast laser cutting, with its near-zero chipping, but is the costliest. It is a best choice for precise cutting and surface slicing of glass, however, it is not suitable for drilling glass.

HANTENCNC’s glass drilling machine uses a MOPA laser. The high peak power enables fiber nanosecond pulsed lasers to process glass, reducing equipment costs and making glass drilling more accessible. This is particularly beneficial for applications that require green or ultrafast lasers.

Model	HTF100	HTF120 Pro	HTF120 Pro+
Laser Power	100W	120W	120W
Central Wavelength	1060-1080nm	1060-1080nm	1060-1080nm
Maximum Peak Power	＞80kw	＞100KW	＞100KW， （The actual power can reach 200W）
Maximum pulse Energy	0.62mj	0.8mj	0.8mj
Power Adjustment Range	0-100%	0-100%	0-100%
Frequency Adjustment Range	1-3000KHZ	1-3000KHZ	1-3000KHZ
Laser On/Off Time	<20μs	<20μs	<20μs
Pulse Width	2-20 ns	2-20 ns	2-20 ns
Beam Quality	M² <1.5	M² <1.4	M² <1.3
High Reflection Resistance	Yes	Yes	Yes
Indicator Red Light	0.3-2 MW	0.3-2 MW	0.3-2 MW
Collimated Beam Diameter (4σ)	10-12 mm	10-12 mm	10-12 mm
Cooling Method	Water cooling	Water cooling	Water cooling
Ambient Temperature Range	0-40 Degrees	0-40 Degrees	0-40 Degrees
Aperture Diameter	14mm	14mm	14mm
Fine Step Response Time	<0.5 ms	<0.5 ms	<0.5 ms
Gain Drift	<50 ppm/K	<50 ppm/K	<50 ppm/K
Zero Drift	<30 urad/K	<30 urad/K	<30 urad/K
Scanning Angle	±0.35 rad	±0.35 rad	±0.35 rad

HANTENCNC’s laser glass drilling machines are CE and FDA-certified. We offer a 2-year warranty for the laser source and a 1-year warranty for the whole machine, sample testing, OEM customization, remote guidance, and lifelong after-sales support.